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This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).
The EBM-250HSC is a device designed and developed for the bonding process of wafers and bonding plates (ceramic plates). It can be used before and after the lapping process to achieve high precision in wafer thickness, flatness, warpage, and parallelism.
Equipped with a 2-stage independent air cylinder! An air press that also addresses safety concerns!
The bonding machine KBM-100 series is an air press equipped with a dual independent air cylinder.
The bonding process can be performed with a single machine, enabling stable bonding!
In addition to various sizes (φ2 inches, φ3 inches, φ4 inches, φ6 inches), we can also manufacture multiple wafer bonding, such as one, three, or five pieces, according to customer requests. The bonding process is performed with a single machine, which includes (1) heating the carrier plate, (2) applying wax, (3) positioning the workpiece, (4) applying pressure, and (5) cooling, enabling stable bonding.
Proven track record in automotive seats and industrial machinery! Large bonding applications are now possible with a bonding machine using thermoplastic resin.
Asahi Textile Machinery Industry Co., Ltd.'s "AGM Series" offers: ■ Bonding with double-sided adhesive interlining ■ Bonding with adhesive interlining ■ Bonding with resin processing applied to the fabric We can accommodate a wide range of applications. By laminating different materials, entirely new materials are created. Our technology is concentrated in the large roller of the Super Roller Machine, with diameters ranging from 200Φ to 350Φ, eliminating roller distortion and enabling strong pressure bonding with good balance on the left, center, and right.
This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).
The EBM-250HC is a device designed and developed for the bonding process of wafers and bonding plates (ceramic plates). It can be used before and after the lapping process to achieve high precision in the thickness, flatness, warpage, and parallelism of the wafers.
It is equipped with a retractable cleaner on the upper and lower belts, keeping the belts clean at all times!
The "YFP-1600S/E" is a bonding machine that employs a large-diameter pressure roller, capable of handling difficult-to-bond materials. It allows for the selection of either steam heaters or electric heaters. Additionally, the heater lift mechanism enables high-quality bonding of plush materials. We also offer other models with different processing widths: "YFP-1800S/E," "YFP-1800S/E," and "YFP-2200S/E." 【Advantages of Hot Melt】 ■ No ventilation equipment required (no toxic gases are generated during processing) ■ Adhesives can be selected according to purpose (breathability, elasticity, flexibility, bonding strength, etc.) ■ Easy recycling and disposal ■ Capable of bonding various similar and dissimilar materials, such as natural materials, synthetic fibers, and polyurethane foam ■ Supports processing of a wide variety of small lots *For more details, please download the PDF or feel free to contact us.
